Japan’s Shin-Etsu Silicone Thermally Conductive Material Thermally Conductive Adhesive Material Additional Reaction Type (Two-Component) KE-1184-AB, KE-1185-AB_HDI Manufacturer | HDI Factory

Additional reaction type of thermally conductive adhesive material (two-component)

		KE-1184-AB	KE-1185-AB	KE-1285-AB	KE-1292-AB	X-4032-3705-AB
Cure Type		two-component additional	two-component additional	two-component additional	two-component additional	two-component additional
Appearance		off-white/off-white	off-white/gray	grey/off-white	Black/Gray	grey/white
Viscosity	Pa-s	50/40	59 / 66	<p style="tex/14	24/15
mixed viscosity	Pa-s	9	15	19
Standard curing grid		120℃×60min	120℃×60min	120℃×60min
Characteristics after curing
Density (23℃)		2.61	2.86	3.00
Hardness	TypeA	20	22	12
stretch length	%	100	60	60
Tensile Strength	MPa	0.4	0.4	0.2
Bond strength Al / Al	MPa	0.3	0.3	0.2
Heat conductivity	W/m-k	1.6	2.2	3.0
Flame Retardancy: UL94		V-0	V-0	V-0 is quite

Features

・ Because of its fluidity, it is suitable for potting with heat-generating components (transformers and coils) in the module

・Low hardness after curing,Reduce the load on glued parts

Take an example

Energy modules, etc.

the

0.4

0.2

Bond strength

Al / Al

MPa

0.3

0.2

Heat conductivity

W/m-k

1.6

2.2

3.0

Flame Retardancy: UL94

V-0

V-0 is quite

Features

・ Because of its fluidity, it is suitable for potting with heat-generating components (transformers and coils) in the module

・Low hardness after curing,Reduce the load on glued parts

Take an example

Energy modules, etc.

the

Japan’s Shin-Etsu Silicone Thermally Conductive Material Thermally Conductive Adhesive Material Additional Reaction Type (Two-Component) KE-1184-AB, KE-1185-AB