HDI Manufacturer | HDI Factory | High Quality HDI Products – chemhdi.com Knowledge Kao Cleanthrough A series dry bun peeling liquid A-07 A-06 A-11D

Kao Cleanthrough A series dry bun peeling liquid A-07 A-06 A-11D

                         

Product List

A-07

A-11D

A-06

A-06A+B)

DevelopmentA

DevelopmentB

purpose

Low Corrosion

Solder bump

precision SAP

thick Dry Film

No ContainsTMAH

precision SAP

Pan WithSAP

TMAH

Contains

Contains

No Contains

No Contains

organic amine

Contains

Contains

Contains

No Contains

Price

Center

Center

Middle high

Low


Product Features
A-07/A-11D: Low Corrosivity
-Prevent corrosion of metal and other peripheral materials
A06: Quick peel off
– High permeability, fine film fragmentation, 30% shorter peeling time than commercially available products
– Suitable for thick film and precision circuit, film thickness ≥100µmt; pitch L/S < 6/6µm
– High resistance to CO2 degradation, 200% more stable to carbonates than commercially available products
Development product: TMAH free
Developed product A – high efficiency type, suitable for precise SAP process
Development product B – general purpose, such as CSP

This article is from the Internet, does not represent the position of Toluene diisocyanate reproduced please specify the source.https://www.chemhdi.com/archives/1839

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