Shin-Etsu Silicone Thermal Conductive Material

The distinction and types of thermally conductive silicone

differentiate kind performance
thermally conductive adhesive ①hardening type (condensation reaction/additional reaction) self-adhesive
thermal grease

①hardening type

②Non-curing

Reworkability (no adhesion)

Reworkability (no adhesion)

thermal silicone

distinguish

Type

Product name

thermally conductive adhesive

hardened

One-component condensation (room temperature curing)

KE-4961-W, KEN-4988-W (Nantong products)

KE-4962-W, KE-3467

One-component addition (heat curing)

KE-1867, KE-1891

two-component additive (heat curing)

KE-1285-AB, KE-1292-AB, X-32-3705-AB (Nantong product)

KE-1897-AB, KE-1898-AB, KE-1899-AB

two-component addition (low temperature curing)

KE-1184-AB, KE-1185-AB

thermal grease

Non-hardening

Solvent-free (thin layer)

G-775, G-777, G-779

Solvent-based (thin coat)

G-776, G-790, G-787

Solvent-based (thin and thick film)

CLG Series

hardened

One-component condensation (room temperature curing)

G-1000

One-component addition (heating/UV)

G-789, GUV-300

two-component additive (room temperature curing)

SDP Series

About condensation and addition reactions

Cure Types and Features

This article is from the Internet, does not represent the position of Toluene diisocyanate reproduced please specify the source.https://www.chemhdi.com/archives/1082

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