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Characteristics and scope of use of dioxydimethyl ether acetate (DMA)

Characteristics and scope of use of dioxydimethyl ether acetate (DMA)

Dioxydimethyl ether acetate

Alias Tetrameric formaldehyde dimethyl ether
Dioxydimethylether acetate
English alias DMA, PDM
2,4,6,8,10-Pentaoxaundacane
CAS 13352-75-5
Chemical formula C6H14O5
Molecular weight 166.17236
Density 1.0671 g/cm3(Temp: 25 °C)
Melting point -8–6.5 °C
boiling point 76-80℃/8Torr
Storage conditions Stored in a dry and ventilated environment Next
Downstream products 2,2′-methylenebisphenol

Product Features

Low Odor: Catering to the current low-odor wood paint coils, high-temperature baking paints, toy paints and plastic paints. Whether it is paint, supporting diluents, the residual state of coating odor during the construction process and after film formation will be reduced because of its presence.


Distillation range: Continuous and stable volatilization characteristics (this product is an oxygen-containing solvent with a unique high fugacity coefficient) 156-256C in between, thus providing ultra-high stability to the film-forming stage, which is conducive to the escape of gas, forming continuous and stable coating performance, improving gloss and leveling. Prevent blistering.


Polarity: This product is a weak polarity The sex solvent type has good mixing properties with other types of solvents and resin materials. The steric hindrance between molecules is low. Although it has a high boiling point, the escape speed is fast enough during the film formation process


Solubility: Relatively speaking, DMA has stronger solubility than PMA, CAC/anti-white water BCS/DAA, and DBE/EGDA is quite environmentally friendly. Ketones should be weak.


Toxicity: Low toxicity, low environmental protection Odor solvent.


Scope of use

Suitable for PU, PE polyester heat curing, polyester polyol, thermoplastic acrylic, NC heat curing Acrylic and other systems. Since the product itself is neutral, it does not contain ammonia, free acid and other ingredients, and the water content is extremely low ≤0.05. It is suitable for products with higher storage stability requirements. The product is an oxygen-containing solvent and is suitable for special thermal curing + UV curing systems. A single UV curing system will have certain oxygen inhibition characteristics.

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