Advantages of silicone-based thermally conductive resin
Compared with non-silicone systems, there is a reduction in heat after various reliability tests blocking effect.
Different products can be selected according to film thickness
Through film adjustment to reduce thermal resistance – G-OOO series
When you need to use a thick film – choose CLG, SDP series
|
Product Name |
G-OOO Series |
CLG series |
SDP series |
|
|
Type |
Single component type |
two-component type |
||
|
Features |
Non-curing |
curing type (condensation, addition) |
Non-curing |
curing type (additional) |
|
use film |
filler |
|||
Non-curing thermal grease containing solvent type
|
|
G-776 |
G-787 |
G-790 |
|
Feature |
Standard |
highheat conduction |
Low thermal resistance |
|
Appearance |
White |
White |
white |
|
Density: 25℃ |
2.9 |
3.48 |
3.2 |
|
Viscosity (Pa-s)Volatilefront |
60 |
70 |
80 |
| Viscosity (Pa-s)Volatileafter | 500 | 200 | 290 |
|
Volatilization (%) 150℃ X 24h |
3.1 |
0.93 |
1.03 |
|
Heat conductivity (W/m-K) before volatilization |
1.0 |
3.3 |
2.6 |
| Thermal conductivity (W/m-K) after volatilization | 1.3 | 4.0 | 3.0 |
|
BLT thickness (μm) |
8 |
32 |
9 |
|
Thermal resistance (mm2-K/W) |
7.4 |
9.5 |
4.7 |
|
Breakdown voltage (kV/0.25mm) |
2.5 |
2.4 |
2.5 |
|
Applicable temperature range (℃) |
-40 ~ 200 |
-40 ~ 200 |
-40 ~ 200 |
2.6
BLT thickness (μm)
8
32
9
Thermal resistance (mm2-K/W)
7.4
9.5
4.7
Breakdown voltage (kV/0.25mm)
2.5
2.4
2.5
Applicable temperature range (℃)
-40 ~ 200
-40 ~ 200
-40 ~ 200
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