Advantages of silicone-based thermally conductive resin
Compared with non-silicone systems, there is a reduction in heat after various reliability tests blocking effect.
Different products can be selected according to film thickness
Through film adjustment to reduce thermal resistance – G-OOO series
When you need to use a thick film – choose CLG, SDP series
|
Product Name |
G-OOO Series |
CLG series |
SDP series |
|
|
Type |
Single component type |
two-component type |
||
|
Features |
Non-curing |
curing type (condensation, addition) |
Non-curing |
curing type (additional) |
|
use film |
filler |
|||
Non-curing thermal grease does not contain solvent type
|
|
G-775 |
G-777 |
G-779 |
|
Feature |
Sag resistance |
Standard |
Low thermal resistance |
|
Appearance |
White |
White |
white |
|
Density: 25℃ |
3.4 |
3.3 |
3.21 |
|
Viscosity (Pa-s) |
500 |
140 |
160 |
|
Volatilization (%) 150℃ X 24h |
0.26 |
0.10 |
0.18 |
|
Heat conductivity (W/m-K) |
3.6 |
3.3 |
3.0 |
|
BLT thickness (μm) |
75 |
59 |
25 |
|
Thermal resistance (mm2-K/W) |
25 |
21 |
11 |
|
Breakdown voltage (kV/0.25mm) |
2.5 |
3.4 |
3.2 |
|
Applicable temperature range (℃) |
-40 ~ 150 |
-40 ~ 200 |
-40 ~ 200 |
n style=”color:#000000″>thermal resistance (mm2-K/W)
25
21
11
Breakdown voltage (kV/0.25mm)
2.5
3.4
3.2
Applicable temperature range (℃)
-40 ~ 150
-40 ~ 200
-40 ~ 200
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