Japan Shin-Etsu silicone RTV cooling material KS609, G746, G747, X-23-7762, X-23-7783D, TC20A, TC20CG, TC-CAD, TC-CAT, TC-CAS, TC-CAB, TC-10SAS, TC -20SAS

Differences in heat dissipation materials

 Thermal conduction effect: thermal grease> phase change material>Heat sink

 operability: phase change material, heat sink> heat conductionSilicone Grease

 Cost: thermal grease<phase change material, heat dissipationpiece

 Irregular plane cooling:

Thermal clay (small area)

Potting (large area)

Heat dissipation materials commonly used by Shin-Etsu

 Silicone Grease:

Low Level: KS-609 ,G-746,G-747

Advanced: X-23 -7762,X-23-7783D

 Heat sink:

High hardness TC-20A, TC-20CG

Low hardness TC-CAD, TC-CAT,TC-CAS,TC-CAB

Double-sided adhesive tape: TC-10SAS, TC-20SAS