Product List
|
A-07 A-11D |
A-06 (A-06A+B) |
DevelopmentA |
DevelopmentB |
purpose |
Low Corrosion Solder bump |
precision SAP thick Dry Film |
No ContainsTMAH precision SAP |
Pan WithSAP |
TMAH |
Contains |
Contains |
No Contains |
No Contains |
organic amine |
Contains |
Contains |
Contains |
No Contains |
Price |
Center |
Center |
Middle high |
Low |
Product Features
A-07/A-11D: Low Corrosivity
-Prevent corrosion of metal and other peripheral materials
A06: Quick peel off
– High permeability, fine film fragmentation, 30% shorter peeling time than commercially available products
– Suitable for thick film and precision circuit, film thickness ≥100µmt; pitch L/S < 6/6µm
– High resistance to CO2 degradation, 200% more stable to carbonates than commercially available products
Development product: TMAH free
Developed product A – high efficiency type, suitable for precise SAP process
Development product B – general purpose, such as CSP