BASF, General Motors and Sun Microstamping win SPE Automotive Innovation Award for battery interconnect board on 2024 Chevrolet Corvette E-Ray

BASF, General Motors and Sun Microstamping with hybrid battery interconnect board (ICB) in 2024 Chevrolet Corvette E-Ray models
Winner of the Society of Plastics Engineers (SPE) Automotive Aftermarket and Limited Edition Special Vehicle Innovation Award. Chevrolet Corvette
ICB design optimization in E-Ray combines the battery sensing wires and buses into a single assembly, where the ICB’s molded frame serves as a fabrication aid for installation and provides electrical isolation between internal and surrounding metal components.

Nick, General Motors Global Battery and Composites Technology Expert
“Being able to reduce multiple assembly methods down to one is a huge win for GM,” said Compton. “Overmolding the ICB reduces the number of components and makes installation easier at the factory.”

The ICB design was injection molded and welded by Sun Microstamping, using BASF’s Ultramid® halogen-free flame-retardant polyamide. This 20% fiberglass-reinforced polyamide allows for a variety of assembly methods such as heat staking, welding, snap-fitting and gluing.

Brooke, Engineering Manager, Sun Microstamping
“Close collaboration with GM technical engineers and their familiarity with BASF materials made this project a success,” Clark said.

Collaboration and innovation throughout the project have huge potential for the automotive sector. A range of material combinations with different properties will support the design of future electric vehicles.

Hadwan, Business Development Manager, Electric Vehicles, Performance Materials Division, BASF
Hadwan said: “At BASF, we know that close relationships with our customers and their customers are critical to the success of automotive projects. With our strong materials portfolio meeting the needs of today’s automotive market, we will continue to develop this portfolio and provide Electric vehicles offer innovative solutions.”