The silicon wafer cutting fluid/cutting fluid market continues to expand, and the industry needs to accelerate transformation and upgrading in the future.
Silicon wafer cutting fluid, also known as silicon wafer cutting fluid, refers to a type of important auxiliary materials and consumables used in the photovoltaic solar silicon wafer cutting process. …
CMP cleaning fluid is mainly used in the wafer manufacturing process. Overseas companies dominate the global market.
CMP technology, also known as chemical mechanical polishing technology, refers to the technology that uses chemical and mechanical methods to flatten wafers during the wafer manufacturing process. The…
The trend of wafer thinning is rising, and the development of the temporary bonding adhesive (TBA) industry is ushering in a period of opportunity.
Temporary bonding adhesive, referred to as TBA, refers to an intermediate layer material used to bond functional wafers and temporary carrier boards. It generally has low cost, high adhesion, good the…
Benefiting from the gradual increase in the trend of chip miniaturization, the development space of the wafer cutting UV film market continues to expand
Wafer cutting refers to an important part of the chip manufacturing process. It refers to the process of dividing the entire wafer of the chip into individual chips (grains) according to the chip size…
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